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(214) 340-7500Purging Compounds
Purging compounds come in a variety of formulations to meet your application. They stop streaking and eliminate black specks, plus dramatically shorten downtimes. Slide’s purging compounds speed up resin-to-resin and color-to-color changes, maximizing your productivity.
Econo-Purge Purging Compound (No. 473)
- Excellent purge for use through hot runner systems
- Safe to purge through the mold
- Helps eliminate color streaking and black specs
- Effectively removes old resin and color residue in extrusion, injection and blow molding operations
- Low odor
- GRAS rated (food-grade) active ingredients safe for food packaging applications
KLENZ Purging Compound (No. 468)
- Excellent for use through hot runner systems
- Safe to purge through the mold
- Helps eliminate color streaking and black specs
- Chemically reactive compound
- Polyolefin resin carrier
- Operating temperatures of 330° - 610°F/165°C - 321°C
- For use with injection molding, extrusion and blow molding
- GRAS rated (food-grade) active ingredients safe for food packaging applications
Purge-Atory Purging Compound (No. 470)
- Recommended for use with gas emitting resins such as Delrin® and acetal
- Safe to purge through the mold
- Helps eliminate color streaking and black specs
- Chemically reactive compound
- SAN resin carrier
- Operating temperatures ranging from 370° - 610°F/187°C - 321°C
NPT: NuPurge Technology Purging Compound (No. 451)
- Complete purging through reactive chemistry
- No need for multiple purging products
- Temp range: 160° - 600°F/71°C - 315°C
- Ready to use; no mixing required
- Run through gates as small as 30 microns
- FDA compliant - ingredients meet G.R.A.S. standards
- Aids with resin-to-resin and color-to-color purges
- Use with most resins
- Not for use with acetal or Delrin®
PDQ Liquid Purging Compound (No. 43432)
- Concentrated liquid purging compound
- Water-based additive (use with barrel temperature above 212’F/100ºC)
- Can be mixed with any carrier resin
- Aids with resin-to-resin and color-to-color purges
- Choose self-measuring bottle or pre-measured packets
- Works with a carrier resin to remove unwanted contamination from the barrel assembly
Hi-Temp Purge Compound (No. 478)
Hi-Temp Purge Compound is Slide’s answer to those jobs where presses are run at temperatures between 485° and 750°F. This formulation aids with the purging of engineering-grade resins, and safely cleans screws and barrels with virtually no odor or smoke. It can remove burned material, color hang-ups, resin deposits, black specks and also soften and remove rust.
Hi-Temp is a chemically reactive, non-abrasive purge utilizing a PET carrier resin. While it is not recommended for cleaning hot runners, it is effective for use with injection molding and is ideal for resins such as PPS, PEEK, PET, LCP and PEI (Ultem™). All ingredients are GRAS rated so it is safe to use for food packaging applications